2 edition of Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium found in the catalog.
Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium
IEEE/CHMT International Electronic Manufacturing Technology Symposium (6th 1989 Nara-shi, Japan)
|Statement||sponsored by Components, Hybrids, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers, Inc., the Steering Committee of the 1989 Japan IEMT Symposium ; co-sponsored by IEEE Tokyo Section, Tokyo Chapter of the CHMT Society in cooperation with the Institute of Electronics, Information, and Communication Engineers ... [et al.].|
|Contributions||IEEE Components, Hybrids, and Manufacturing Technology Society., IEEE/CHMT International Electronic Manufacturing Technology Symposium (6th : 1989 : Nara-shi, Japan).|
|LC Classifications||TK7836 .I4 1989a|
|The Physical Object|
|Pagination||xvi, 366 p. :|
|Number of Pages||366|
|LC Control Number||89083791|
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Ninth IEEE/CHMT International Electronics Manufacturing Technology Symposium, "Competitive Manufacturing for the Next Decade", October , , Washington, DC USA. IEEE Service Center, c タイトル別名. IEEE/CHMT Ninth International Elctronic Manufacturing Technology Symposium. 90CH Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium, "Electronics manufacturing for the year ", October , , Santa Clara, CA USA sponsored by the Electronic Industries Association(EIA) and the Components, Hybrids, & Manufacturing Technology(CHMT) Society IEEE Service Center, c soft.: case.: micro.
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Get this from a library. Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium: proceedings Japan IEMT Symposium, April, Nara, Japan. [IEEE Components, Hybrids, and Manufacturing Technology Society.;]. Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium.
Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade Location: Washington, DC, USA Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium Location: Nara.
SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM "INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY' UNIVERSITATSeieUOTHEK HANNOVER TECHNISCHE The International Electronic Manufacturing Technology (IEMT) Symposium is a principal forum for the.
NINTH IEEE/CHMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM "Competitive Manufacturing For The Next Decade' The International Electronics Manufacturing Technology (IEMT) Symposium is a principal forum for the presentation of new developments in and applications of automated equipment and systems for the manufacture of electronic.
In: Proceedings of Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium; April ; Nara Japan. Electronic Manufacturing Technology Symposium,Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International: IEL: Proceedings, 'Competitive Manufacturing for Next Decade'.
IEMT Symposium, Ninth IEEE/CHMT International: IEL: INDEST: Electronic Manufacturing Technology Symposium,Proceedings of. The process diagram for bonding Au wires on glass is illustrated in Fig. process step is described in more detail in the following sections. A widely used % pure (4 N) 25 μm diameter Au wire was chosen for bonding due to its high consistency, ease of process setup, and good bond reliability.
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Olmer, et al., “Intermetal Dielectric Deposition by Plasma Enhanced Chemical Vapor Deposition,” Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium—Design-to-Manufacturing Transfer Cycle, pp. ; Oct. 10, “3D Multichip Module to be Demonstrated,” Electronic Design, Apr.
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Wolf, G. Chmiel, J. Simon, and J. Simon. “Solderbumping—A Comparison of Different Technologies,” Proceedings First International Symposium on Flip Chip Technology & Sixth International TAB/Advanced Packaging Symposium, pp.
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